Wafer Inspection and Metrology

Inline and Lab Based X-ray Inspection and Metrology Solution

Nordson TEST & INSPECTION offers a comprehensive range of inline and lab based X-ray inspection and metrology solutions for assessing and monitoring wafer level quality.

Check shape, fill level and voiding in TSV through silicon vias.
Inspect build quality, wire bonds, component alignment and solder & adhesive voiding during MEMS manufacture.
Check for bump presence, shape, position and voiding in wafer bumps.
Find defects such as cold joints, head in pillow and misalignment in 2.5D and 3D wafer level packages.

Our Products

Nordson TEST & INSPECTION AXM Products

Quadra 7

Ultimate image quality at 0.1 µm feature recognition, Quadra 7 is the most capable X-ray tool on the market for failure analysis and production quality control. With component and board sizes getting smaller all the time, Quadra 7 ensures your quality needs are met today, and well into the future.

XM 8000

The complete solution for operator free, automated X-ray wafer metrology. XM8000 is specifically designed for inline use in clean room environments.

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Automanted X-ray Metrology

Semiconductor Metrology

Inline and Lab Based X-ray Inspection and Metrology Solution

Nordson TEST & INSPECTION AXM Products

Quadra 7

XM 8000